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RTL8213B-CG_Datasheet_v0.1
RTL8213B-CG Datasheet
10/100/1000M Copper to 100Base-FX/1000Base-X Fiber Media Converter
Rev. 1.0
30 Dec. 2018
The RTL8213B-CG is a QFN40, high-performance media converter featuring low-power integrated 1-port
Giga-PHY that support 1000Base-T, 100Base-TX, and 10Base-T.
2020-10-15
MH5000_REF_SCH_MH5000_871_V1.1.pdf
MH5000-871模块参考设计图
01 This document just show the reference circuit of the NAD's interface
02 For the circuit design of the peripheral device, please refer to the device's datasheet.
2020-10-13
MH5000-871 Hardware Guide
This document describes the hardware application interfaces and air interfaces
provided by HUAWEI MH5000-871 LGA module.
This document helps hardware engineers to understand the interface specifications,
electrical features and related product information of the MH5000-871 LGA module.
2020-10-13
HUAWEI MH5000系列 5G模块AT命令手册-(V100R001_01, Chinese)_2020.3.31.pdf
HUAWEI MH5000 系列 5G 模块
V100R001 AT命令手册
文档版本 01
发布日期 2020-2-28
本文根据终端设备的需求,实现了国际标准(如 3GPP 和 ITU-T)中的部分 AT 命
令。本文还描述了终端设备实现的私有 AT 命令接口,私有 AT 命令接口是为了更好
或更方便地实现某种功能。
本文不描述标准已经定义或 MT 已实现,但华为终端产品需求涉及不到的接口。对于
AT 命令接口的描述,仅限于接口数据包本身,以及 TE 和 MT 对接口的使用方法和
使用流程,不包括与接口不直接相关的内容。本文也仅限于描述 TE 和 MT 之间 Rm
接口范围内的 AT 命令接口,而不描述 MT 与 IWF 之间 Um 接口范围内的 AT 命
令接口。
AT 命令是 TE 和 MT 之间的通信命令协议。如果有新款 MT 产品需要和现有 TE
对接,而现有 TE 是按照本 AT 规范实现的,则新款 MT 必须遵守此规范才能保证
两者成功对接。比如新款模块和现有 PC 统一后台对接,那么新款模块必须遵守此规
范;反之亦然,比如新开发某 PC 后台或 PC 工具,也要遵守此规范,才能和现有的
终端产品对接。若 TE 和 MT 不用 AT 命令通信,则不受本规范限制。
2020-05-12
MT6737_Datasheet.pdf
MT6737 数据手册 288页
Version: 1.0
Release date: 2016-01-15
Specifications are subject to change without notice.
MT6737 LTE Smartphone Application
Processor Functional Specification
2020-05-12
eMCP3+16+24G MT29TZZZ7D6JKKFB-107
eMCP3+16+24G MT29TZZZ7D6JKKFB-107数据手册
Our e.MMC-Based MCPs do more than meet the memory requirements of mid-tier phones, tablets, auto infotainment systems and smart watches. They save more than 40% space versus discrete memory—reducing the memory footprint, simplifying PCB design, and speeding time to market. Built on a foundation of Micron-manufactured e.MMC (MLC/TLC NAND + microcontroller) and LPDRAM, these JEDEC-compliant, footprint-compatible devices enable simple and flexible system design and certification.
2018-07-24
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