sdut_guol的专栏

mqttfx-5.0.5-windows-x64.msi 官网下载的，

SDK_2.9.1_EVK-MIMXRT1020_doc.zipSDK_2.9.1_EVK-MIMXRT1020_doc.zipSDK_2.9.1_EVK-MIMXRT1020_doc.zip

SDK_2.9.1_EVK-MIMXRT1020 SDK_2.9.1_EVK-MIMXRT1020 SDK_2.9.1_EVK-MIMXRT1020

Notepad++ v7.9.5 bug-fixes: 1. Fix Notepad++ not starting up due to SaveAsAdmin plugin (for installer package). 2. Fix UNC path with quotes handling in folder & file Open/Save dialog. 3. Fix file doesn't save as extension type on Windows 7.

Molex_EIPTool_V2_3(ODVA) EIP Scanner and Adapter Network Interface Cards ...

ITECH通用光盘 包括 ├─AutoPlay │ │ autorun.cdd │ │ │ ├─Audio │ │ Click1.ogg │ │ High1.ogg │ │ │ ├─Buttons │ ├─Docs │ │ 新光盘.am6 │ │ │ ├─Flash │ ├─Icons │ ├─Images │ │ 00005.jpg │ │ 00005_1.jpg │ │ 00005_2.jpg │ │ 00005_3.jpg │ │ 01.jpg │ │ 01_1.jpg │ │ 01_2.jpg │ │ 01_3.jpg │ │ 02.jpg │ │ 02_1.jpg │ │ 02_2.jpg │ │ 02_3.jpg │ │ 03.jpg │ │ 04.jpg │ │ 05.jpg │ │ 06.jpg │ │ 07.jpg │ │ 08.jpg │ │ 09.jpg │ │ 光盘界面.jpg │ │ 首页界面.jpg │ │ 首页界面3.jpg │ │ │ ├─Plugins │ │ sb_Charcoal.png │ │ sb_Euro.png │ │ │ ├─Scripts │ └─Videos ├─Example │ ├─labview │ │ ├─IT6500 │ │ │ 6512LABVIEW.rar │ │ │ │ │ ├─IT6900A │ │ │ IT69 TEST-list.zip │ │ │ │ │ ├─IT8500 │ │ │ (CV)-02.zip │ │ │ 负载控制子VI7.27_Itech.zip │ │ │ │ │ ├─IT8700 │ │ │ 8700Labview.rar │ │ │ │ │ └─IT8800 │ │ LIST.zip │ │ 动态.zip │ │ │ ├─VB │ │ ├─IT6512 │ │ │ IT6512-VB-源程序.rar │ │ │ │ │ ├─IT6900A-VB │ │ │ IT6900A-VB-源程序.rar │ │ │ │ │ ├─IT85OO │ │ │ VB_26Byte.rar │ │ │ VB_8500_GPIB.rar │ │ │ VB_Load_MulOcx(test ok).rar │ │ │ │ │ ├─IT8700 │ │ │ IY87VB_Example.rar │ │ │ │ │ └─IT8800 │ │ Test8811-OCP.zip │ │ │ └─VC │ ├─IT6100 │ │ │ VC_6100_Scrip.zip │ │ │ │ │ └─VC_6100_Scrip │ │ │ dos下的C实例.CPP │ │ │ ReadMe.txt │ │ │ resource.h │ │ │ SerialPort.cpp │ │ │ SerialPort.h │ │ │ SerialPortTest.aps │ │ │ SerialPortTest.clw │ │ │ SerialPortTest.cpp │ │ │ SerialPortTest.dsp │ │ │ SerialPortTest.dsw │ │ │ SerialPortTest.h │ │ │ SerialPortTest.ncb │ │ │ SerialPortTest.opt │

ITECH-通用-232046\CD_Root\User's manual\IT6300\IT6322-UM-CN-222356

ITECH-通用-232046\CD_Root\User's manual\IT6300\IT6302-UM-CN-231636.pdf

ITECH-通用-232046\CD_Root\User's manual\IT6300\IT6302-UM-CN-231636.pdf

ITECH-通用-232046\CD_Root\User's manual\IT6300\IT6300-UM-EN.pdf

ITECH-通用-232046\CD_Root\User's manual\IT6300\IT6300B-UM-CN-231551.pdf

Doxygen是一种开源跨平台的，以类似JavaDoc风格描述的文档系统，完全支持C、C++、Java、Objective-C和IDL语言，部分支持PHP、C#。注释的语法与Qt-Doc、KDoc和JavaDoc兼容。Doxygen可以从一套归档源文件开始，生成HTML格式的在线类浏览器，或离线的LATEX、RTF参考手册。 本资源包括win安装包和PDF文档： doxygen_manual-1.9.1.pdf.zip doxygen-1.9.1-setup.exe

MCUXpresso Config Tools data. MCUXpresso Config Tools data download MCUXpresso Config Tools data download

The MCUXpresso Config Tools is an integrated suite of configuration tools that help guide users from first evaluation to production software development when designing with Arm® Cortex®-M-based devices from NXP, including its general purpose, crossover and Bluetooth™-enabled MCUs. These configuratio

NXP RT1020系列单片机 SDK SDK_2.8.2_EVK-MIMXRT1020.zip canopen 2020/12/15 15:32 fatfs 2020/12/15 15:32 freemaster 2020/12/15 15:32 issdk 2020/12/15 15:32 littlevgl 2020/12/15 15:32 lwip 2020/12/15 15:32 <DI

1、DeviceNet规范简介.pdf 2、DeviceNet协议I：协议规范.pdf (完整DeviceNet协议描述) 3、DeviceNet协议II：设备描述及对象库.pdf 4、DeviceNet™ Group 2 Slave Firmware for PIC18 with CAN 5、DeviceNet协议 C源码（Microchip DeviceNet Stack Processor: PIC18F with CAN）

JLink_Windows_V683b.exe jlink驱动，jlink 0b 072 优化后还未增加授权验证的版本 使用jlink 0b 072可以下载这个版本，可以提高30%以上的程序烧写速度

JLink_Windows_V682g Jlink ， 官方驱动 搬运自Jlink官网 版本：V682g

1 i.MX RT1064 Introduction The i.MX RT1064 is a new processor family featuring NXP’s advanced implementation of the Arm Cortex®-M7 core, which operates at speeds up to 600 MHz to provide high CPU performance and best real-time response. The i.MX RT1064 processor has 4 MB on chip Flash and 1 MB on-ch

MIMXRT1021DAF5A检测报告 340000139595_ZT_HALOGEN 340000139595_ZT_PHTH 340000139595_ZT_ROHS等等

PUB00123R1_Common-Industrial_Protocol_and_Family_of_CIP_Networks.pdf The Common Industrial Protocol (CIP™) and the Family of CIP Networks Contents 1. Introduction 7 2. Description of CIP 10 2.1. Object Modeling 12 2.2. Services 14 2.3. Messaging Protocol 14 2.4. Communication Objects 16 2.5. Object Library 18 2.6. Device Profles 26 2.7. Confguration and Electronic Data Sheets 27 2.8. Bridging and Routing 29 2.9. Data Management 30 3. Network Adaptations of CIP 33 3.1. DeviceNet™ 33 3.2. ControlNet™ 54 3.3. EtherNet/IP™ 65 3.4. CompoNet™ 82 4. Benefts of The CIP Family 93 4.1. Benefts for the Manufacturer of Devices 93 4.2. Benefts for the Users of Devices and Systems 93 5. Application Layer Enhancements 94 5.1. CIP Sync™ and CIP Motion™ 94 5.2. CIP Safety™ 99 6. Conformance Testing 121 7. Endnotes 123 8. Bibliography 126 9. Related Publications 126 10. Abbreviations 127 11. Terminology 129

J-Link Software and Documentation pack for Windows Installing the software will automatically install the J-Link USB drivers and offers to update applications which use the J-Link DLL. Multiple versions of the J-Link software can be installed on the same PC without problems; they will co-exist in different directories.

Wireshark-win64-3.0.6.zip Wireshark-win64-3.0.6.zip Wireshark-win64-3.0.6.zip

480 x 128, Dot Matrix High Power OLED/PLED Segment/Common Driver with Controller

J-Link Software and Documentation pack for Windows Installing the software will automatically install the J-Link USB drivers and offers to update applications which use the J-Link DLL. Multiple versions of the J-Link software can be installed on the same PC without problems; they will co-exist in different directories.

github上的开源项目 支持FreeModbus主站和从站 https://github.com/armink/FreeModbus_Slave-Master-RTT-STM32 另外附Modbus协议中文文档

EWARM_DevelopmentGuide.ENU.pdf IAR开发指南 IAR C/C++ Development Guide Compiling and Linking

IAR RT1021 flashloader，NXP RT1021芯片，支持华邦Nor Flash W25Q256JV.用于RT1021在IAR上使用Nor Flash XIP运行和Debug

\I.MXRT105X从外部SPI FLASH启动V1.2.2\FIRMWARE │ I.MXRT105x从外部SPI Flash启动v1.2.2.pdf │ system_MIMXRT1052.c │ ├─IAR linker files │ MIMXRT1052xxxxx_flexspi_code_sdram_data.icf │ MIMXRT1052xxxxx_hyperflash_nor_bootok.icf │ ├─IAR_8.20_Flashloader │ └─ISSI_GD_WinBond_ISSI_QSPI │ FlashIMXRT1050_EVK_FlexSPI.board │ FlashIMXRT1050_EVK_FlexSPI.flash │ FlashIMXRT1050_EVK_FlexSPI.mac │ FlashIMXRT1050_EVK_FlexSPI.out │ ├─Keil linker files │ MIMXRT1052xxxxx_flexspi_nor_xip_sdram.scf │ ├─Keil_FlashAlgorithm │ MIMXRT_QSPIFLASH.FLM │ └─xip fsl_flexspi_nor_boot.c fsl_flexspi_nor_boot.h fsl_flexspi_nor_flash.c fsl_flexspi_nor_flash.h

.\FLASHLOADER_RT1020_1.0_GA │ LA_OPT_Base_License.htm │ SW_Content_Register_Kinetis_Bootloader.txt │ ├─doc │ i.MX MCU Manufacturing User's Guide.pdf │ I.MXRT1020 Flashloader v1.0.0 Release Notes.pdf │ Kinetis blhost User's Guide.pdf │ Kinetis SDPHost User's Guide.pdf │ MCUX Flashloader Reference Manual.pdf │ ├─example_images │ led_demo_evk_flexspi_nor_0x60002000.elf │ led_demo_evk_flexspi_nor_0x60002000.srec │ led_demo_evk_ram_0xa000.elf │ led_demo_evk_ram_0xa000.srec │ plugin_boot_0x60002000.elf │ plugin_boot_0x60002000.srec │ ├─Flashloader │ flashloader.elf │ flashloader.srec │ └─Tools ├─bd_file │ └─imx10xx │ enable_hab.bd │ imx-dtcm-encrypted.bd │ imx-dtcm-signed.bd │ imx-dtcm-unsigned.bd │ imx-flexspinor-normal-signed.bd │ imx-flexspinor-normal-unsigned.bd │ imx-flexspinor-plugin-signed.bd │ imx-flexspinor-plugin-unsigned.bd │ imx-itcm-encrypted.bd │ imx-itcm-signed.bd │ imx-itcm-unsigned.bd │ imx-ocram-unsigned.bd │ program_flexspinor_image_hyperflash_3v0.bd │ program_flexspinor_image_hyperflash_encrypt.bd │ program_flexspinor_image_micron_mt35x.bd │ program_flexspinor_image_mxic_mx25um51245g.bd │ program_flexspinor_image_mxic_mx25um51345g.bd │ program_flexspinor_image_qspinor.bd │ program_flexspinor_image_qspinor_status_reg1_bit6.bd │ program_flexspinor_image_qspinor_status_reg2_0x31.bd │ program_flexspinor_image_qspinor_status_reg2_bit1.bd │ program_flexspinor_image_qspinor_status_reg2_bit7.bd │ program_sdcard_encrypt_image_keyblob.bd │ program_sdcard_image.bd │ ├─blhost │ ├─linux │ │ ├─amd64 │ │ │ blhost │ │ │

The i.MX RT1020 processors are NXP's latest additions to a growing family of real-time processing products offering high-performance processing optimized for lowest power consumption and best real-time response. The i.MX RT1020 processors feature NXP's advanced implementation of the ARM®Cortex®-M7 core.

野火_IMX+RT1021+EVK_原理图_V1.0.pdf

Splashtop Wired XDisplay Turn your iPad, Android tablet, Kindle or smartphone into a high performance extra monitor for your computer

WinPcap Has Ceased Development The WinPcap project has ceased development and WinPcap and WinDump are no longer maintained. We recommend using Npcap instead. The last official WinPcap release was 4.1.3 For the list of changes, refer to the changelog. Version 4.1.3 Installer for Windows Driver +DLLs Supported platforms: Windows NT4/2000 Windows XP/2003/Vista/2008/Win7/2008R2/Win8 (x86 and x64) MD5 Checksum: a11a2f0cfe6d0b4c50945989db6360cd SHA1 Checksum: e2516fcd1573e70334c8f50bee5241cdfdf48a00 This executable file installs WinPcap on your machine. Instructions Download and run the executable Follow the instructions on the screen. The installation applet will automatically detect the operating system and install the correct drivers The WinPcap-based applications are now ready to work To remove WinPcap from the system, go to the Control Panel, click on &quot;Add/Remove programs&quot; and then select &quot;WinPcap&quot;

PROFINET TPS-1 Development Toolkit IEC 61131 Control If you are interested in IEC 61131 Control or IEC 61508 Safety, please contact us. IEC 61508 Safety If you are interested in IEC 61131 Control or IEC 61508 Safety, please contact us. PROFINET Industrial Ethernet

S7-300 CPU 31xC 和CPU 31x硬件和安装手册 S7-300-CPU-31XC指令表 S7-300可编程控制器硬件和安装手册 S7-300模板规范2004.02 STEP 7 V5.4 编程

RX-8025英文版和中文版

RCCN 日成端子产品介绍 WWW.RCCN.COM.CN Disconnects Non-Insulated Terminals Type Y Type YFN Maximum recommended operating temperature 150°C (302°F) Extended barrel length assures a good quality crimp and makes crimping easier Brazed seam assures crimp reliability Internally beveled barrel for quick easy wire insertion Internal barrel serrations assure good wire contact and maximum tensile strength Nylon Insulated Terminals Internal barrel serrations assure good wire contact and maximum tensile strength Maximum insulation temperature 105°C (221°F) Color coded insulation identifies wire range Sleeved barrel assures Insulation grip sleeve crimp reliability provides a superior insulation crimp for high vibration and high strain relief applications Non-Insulated Seamless Tubular Terminals Type SC Internally beveled barrel for quick easy wire insertion Double thickness provides a strong ring tongue Product markings provide easy identification of wire sizes Inspection hole allows visual inspection for proper wire insertion Seamless tubular barrel provides consistent, high performance, quality crimps 105°C 75°C RCCN压着端子的特性 O2 产品线丰富 提供种类丰富的产品系列和具备竞争力的交货期提供快速高效的定 制生产服务 本目录列出了各类RCCN标准型压着端子和接续端子。大批量生产可 有效降低产品价格并缩短交货期。根据使用环境从本目录中选择兼 容的产品型号，不失为一项最经济的方案。除此以外，本公司也会 提供快速高效的定制生产服务。详情请垂询本公司。 绝缘材料 具有出色的阻燃性和绝缘性的塑料和尼龙绝缘材料 RCCN绝缘端子的主要特性包括出色的耐热、耐冷、耐油、耐火性能 和优异的绝缘性能。 标准型端子采用特殊塑料和尼龙两种绝缘材质， 并有多种颜色供您选择。当施加所需的压着力时，传统的塑料或尼龙 材料会发生断裂或形变，且无法经受严苛的使用条件。RCCN绝缘端 子的与众不同之处在于采用了强度和绝缘性能极为出色的绝缘材料。 RCCN绝缘端子，其中塑料绝缘端子和尼龙绝缘端子的额定温度值分 别为75℃和105℃。 注意： 由于尼龙绝缘端子的吸水率高于塑料绝缘端子，因此如果将此类端子存放在高湿场所， 或者在高温、高湿季节进行压着，其压着性能可能会降低。 焊接 高强度焊接 大部分RCCN标准型产品可通过全自动焊接机实现高质量焊接作业。 端子材料 具备出色电气性能的紫铜 RCCN标准型端子均采用紫铜。这种材料具备出色的导电率和固有韧 度，可安全可靠地进行焊接作业，不会出现氢脆现象。此外，与其 他铜材料相比， 紫铜拥有更加出色的电气和机械性能。有关使用铜 以外的特殊材料的型号信息，请垂询本公司。 电镀 除了锡以外，本公司还提供采用其他金属镀料的专用产品。 RCCN的标准型产品均经过电镀处理（镀锡），并采用RCCN独创的 特殊工艺，因而具备出色的耐腐蚀性。这种工艺处理方式能确保电镀 层具备最大的附着强度，从而进一步降低电阻值，提升耐腐蚀性。 除 了锡以外，本公司还使用银、镍等金属作为镀料。有关使用特殊电镀 工艺的产品信息，请垂询本公司。 裸端子 最高工作温度150 °C 产品上标示容易识 别的使用电线的尺寸 Productmarkings provide easy identi

第一章、绪论 第二章、基本图形生成原理 第三章、图形几何变换 第四章、多边形及多边形填充算法 第五章、图案及动画程序设计 第六章、裁剪算法 第七章、自由曲线

PROFINET规范