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本文档为BC95 模块的参考设计，主要包含模块、电源、USIM、串口等接口设计。如下为BC95 模块的设计原理图。本设计仅作参考。

Quectel_BC95_PCB_FootPrint_Protel&AD;_20170925.LIB Quectel_BC95_SCH_Part_Protel&AD;_20170925.lib Quectel_BC95_PCB_Footprint_Pads_20170925.pcb Quectel_BC95_SCH_Part_Pads_20170925.sch Quectel_BC95_PCB_Footprint_Cadence_20170925.dra Quectel_BC95_SCH_Part_Cadence_20170925.OLB

移远 Quectel BC28 BC35 AT命令手册 V1.0

Features ------ Current：250 mA Low Dropout: 150 mV @ 100mA (VOUT≧2.0 V) High Accuracy of Output Voltage ±2.0% : VOUT≧2.5 V ±50mV : VOUT≦2.5 V High Ripple Rejection：60 dB Output Current Limit Protection (350mA) Short Circuit Protection (200mA) Thermal Overload Shutdown Protection Low ESR Capacitor Compatible SOT-23, SOT-25, SOT-89, UFN-6 ,and TO92 Packages RoHS Compliant and 100% Lead (Pb)-Free and Green (Halogen Free with Commercial Standard)

Features ---------- .Ultra-Low-Noise for RF Application .Ultra-Fast Response in Line/Load Transient .Quick Start-Up (Typically 50μs) .< 0.01μA Standby Current When Shutdown .Low Dropout : 220mV @ 300mA .Wide Operating Voltage Ranges : 2.5V to 5.5V .TTL-Logic-Controlled Shutdown Input .Low Temperature Coefficient .Current Limiting Protection .Thermal Shutdown Protection .Only 1μF Output Capacitor Required for Stability .High Power Supply Rejection Ratio .Custom Voltage Available .RoHS Compliant and 100% Lead (Pb)-Free

Features • Output voltage ranges: Fixed range of 1.8V, 2.5V, 2.7V, 3.0V, 3.3V, 5.0V type. • Highly accuracy: ±2% • Low voltage drop: 360mV (typ.), VOUT=5.0V at 500mA • Guaranteed output current: 500mA • Low quiescent current: 4mA (typ.) • Current limiting • Over-temperature shutdown • SOT23-5 and SOT89 Packages

LDO HT7533 Datasheet 手册 Features Low power consumption Low voltage drop Low temperature coefficient High input voltage (up to 24V) High output current : 100mA Output voltage accuracy: tolerance 3% TO92, SOT89 and SOT23-5 package Applications Battery-powered equipment Communication equipment TO92 SOT89 SOT23-5 75XX-1 (for TO92) 75XX-1 (for SOT89) 5XX1 (for SOT23-5) HT7521-1 2.1V HT7523-1 2.3V HT7525-1 2.5V HT7527-1 2.7V HT7530-1 3.0V HT7533-1 3.3V HT7536-1 3.6V HT7540-1 4.0V HT7544-1 4.4V HT7550-1 5.0V HT7560-1 6.0V HT7570-1 7.0V HT7580-1 8.0V HT7590-1 9.0V HT75A0-1 10.0V HT75C0-1 12.0V

v2.1 2018-09-14 1. Modified parameter of AT+QLWULDATAEX (added RELEASE_AFTER_REPLY RAI flag). 2. Added note: network attachment should be triggered by AT+CGATT=1 but not AT+CFUN=1 in Chapter 3.17. 3. Modified the range of for AT+NSOCR. v2.0 2018-05-14 1. Added following new AT commands: AT+CGAUTH/AT+NPIN/AT+NCSEARFCN 2. Updated description of parameters for AT+NPSMR/ AT+QSECSWT/AT+QSETPSK/AT+QLWULDATAEX 3. Added maximum response time for all AT commands 4. Added example for AT+NPING 5. Updated description of error responses

NB-IoT 系列 版本：BC26_参考设计手册_Rev.A 日期：2018-07-03 本文档为BC26 模块的参考设计，主要包含模块、电源、USIM、串口等接口设计。

NB-IoT 系列 版本：BC26_硬件设计手册_V1.0 日期：2018-07-04

NB-IoT Module Series Rev. BC26_AT_Commands_Manual_V1.0 Date: 2018-08-02 Status: Released

最新版！ 1. ERROR 513 问题解决方案的说明 2. 增加BC95 模组波特率特性的说明 3. 增加B657SP2 版本支持命令回显功能的说明

s132_nrf52_3.1.0 This version of the SoftDevice improves robustness to bit errors in received packets and adds some minor features compared to version 3.0.0. Memory requirements and functional performance are equivalent to version 3.0.0. Refer to the release notes of version 3.0.0 for further information. New functionality GAP It is now possible to disable and enable slave latency on an active peripheral link. A new option in the GAP options API has been added for this (DRGN-7831). It is now possible to disable the initiation of DLE procedure. A new option in the GAP options API has been added for this (DRGN-8248). It is now possible to respond with the configured ATT_MTU size during DLE procedure. Default behavior is to respond with the currently used ATT_MTU size. A new option in the GAP options API has been added for this (DRGN-8335). It is now possible to completely disable the DLE feature. A new option in the GAP options API has been added for this (DRGN-8172). A new compatibility mode has been added to enable interoperability with central devices that may initiate version exchange and feature exchange control procedures in parallel (DRGN-8232).

s132_nrf52_4.0.4 This is a production release that contains minor but important changes to the 4.0.3 release. SoftDevice properties The SoftDevice Specification v4.1, available in the Nordic Semiconductor Infocenter, is applicable for this release. This version of the SoftDevice contains the Master Boot Record (MBR) version 2.1.1 (DRGN-8649). The combined MBR and SoftDevice memory requirements for this version are as follows: Flash: 124 kB (0x1F000 bytes). RAM: 4.94 kB (0x13C0 bytes) This is the minimum required memory. The actual requirements depend on the configuration chosen at sd_ble_enable() time.

s130_nrf51_2.0.1 This is a minor release of the s130_nrf51 Softdevice. This release provides minor bug fixes and documentation updates. Notes: This SoftDevice version is compatible with the latest nRF51 IC revision (revision 3). It is not compatible with nRF51 IC revisions 1 and 2. Users of the SoftDevice must verify the compatibility of their SoftDevice/IC combination for development and for production. Compatibility information is found in the nRF51 Series Compatibility Matrix, which can be accessed at infocenter.nordics emi.com. SoftDevice properties This version of the SoftDevice contains the Master Boot Record (MBR) version 1.0.3. The combined MBR and SoftDevice memory requirements for this version are as follows: Flash: 108 kB (0x1B000 bytes). RAM: 4.95 kB (0x13C8 bytes) (minimum required memory - actual requirements are dependent upon the configuration chosen at sd_ble_enable() time).

s120_nrf51_2.1.0 The changes in this release are the resolution of a SoftDevice assert when measuring connection RSSI and a very small reduction in the size of the GATT Server Attribute Table. The API header files and all functionality remain unchanged from the previous version. Notes: This SoftDevice version is not Production tested on all IC revisions, and is not compatible with nRF51 IC revision 1. Users of the SoftDevice must verify the compatibility of their SoftDevice/IC combination for development and for production. Compatibility information is found in the nRF51 Series Compatibility Matrix, which can be downloaded from the Nordic Semiconductor web page. The Bluetooth qualification listings covering the s120 2.0.0 SoftDevice also cover this release. SoftDevice properties The SoftDevice Specification corresponding to this release is the S120 nRF51 SoftDevice Specification v2.0. This version of the SoftDevice contains the Master Boot Record (MBR) version 1.0.0. The combined MBR and SoftDevice memory requirements for this version are as follows: Flash: 116 kB (0x1D000 bytes) RAM: 10 kB (0x2800 bytes)

s110_nrf51822_7.3.0 This is a bugfix release only. Notes: This SoftDevice version is not Production tested on all IC revisions. Users of the SoftDevice must verify the compatibility of their SoftDevice/IC combination for development and for production. Compatibility information is found in the nRF51 Series Compatibility Matrix, which can be downloaded from the Nordic Semiconductor web page. Changes No changes in this version Bug fixes LL Fixed an assert that could be triggered if the actual clock accuracy of the peer is lower than what declared in the connect request packet and a packet is received exactly at time out (DRGN-5400).

s110_nrf51_8.0.0 The main features of this release are the ability to set the size of the GATT Server Attribute Table when initializing the BLE stack, the possibility for the application to be notified when the SoftDevice receives scan requests, and the ability to disable RF channels for advertising. Changes to CPU availability during radio events, DC/DC converter configuration, and PPI channel allocations have been made to take advantage of the nRF51 series IC revision 3. The BLE API has been aligned to that of the S120 SoftDevice. Notes: This is a major release which has changed the Application Programmer Interface (API), requiring applications to be recompiled. This SoftDevice version is not Production tested on all IC revisions, and is not compatible with nRF51 IC revision 1. Users of the SoftDevice must verify the compatibility of their SoftDevice/IC combination for development and for production. Compatibility information is found in the nRF51 Series Compatibility Matrix, which can be downloaded from the Nordic Semiconductor web page. SoftDevice properties The SoftDevice Specification corresponding to this release is the S110 SoftDevice Specification v2.0. This version of the SoftDevice contains the Master Boot Record (MBR) version 1.0.1. The combined MBR and SoftDevice memory requirements for this version are as follows: Flash: 96 kB (0x18000 bytes). RAM: 8 kB (0x2000 bytes) (default value - dependent upon configured size of the GATT Server Attribute Table). New functionality SoftDevice The application can now configure the amount of memory reserved for the GATT Server Attribute Table when initializing the BLE stack (DRGN-3744). Configuration is optional. By default, the RAM reserved for the Attribute Table will be 0x700 bytes. This is the same default allocation as in the S110 v7.1.0. GAP The application can now configure the SoftDevice to deliver events when scan request packets are received (DRGN-2880, NRFFOETT-281). The application can now selectively dis

极漂亮的PPT模板 658TGp_fruit_light_ani_red 下载你肯定不后悔。在同样类型的模板中间可以相互粘贴，色系会自动调整到一致状态，非常亮眼。

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非常漂亮的PPT模板，在同样类型的模板中间可以相互粘贴，色系会自动调整到一致状态，非常亮眼。