u012304324的博客

这是由机械工业出版社出版的书籍《集成电路版图设计》

There are four topics that I categorize under packaging and enclosure design and analysis. These are electromagnetic, thermal, mechanical, and thermomechanical analyses. We do not cover electromagnetics here; however, its importance cannot be overstated. Unfortunately, much of the analysis for electromagnetic interference (EMI) or electromagnetic compatibility (EMC) is done as an after event. Testing is done once the system is developed and often coupling and interactions are ignored. EMI is difficult to calculate exactly; however, back-of-the-envelope estimates may be developed to ensure higher end-product compliance. Thermal analysis is concerned with calculating the component-critical temperatures. Mechanical analysis is concerned with the housing of the electronics (from component housing to PCB to enclosure and finally to the rack) as well as the ability of this housing to maintain its integrity under various loading conditions such as shock and vibration. Thermomechanical management is concerned with the impact of thermal loads on the mechanical behavior of the system. In this work, we set the foundation for thermal and mechanical analyses of electronics packaging/enclosure design.

This paper describes what an eye diagram is, how it is constructed, and common methods of triggering used to generate one. It then describes different ways that information from an eye diagram can be sliced to gain more insight. It also discusses some basic ways that transmitters, channels, and receivers are tested. It is designed to give an engineer new to this feld a basic grasp of the concepts commonly used

本文的目的是提供引一些有關在數位系統訊號完整性相關的見解，並說明其原因、特點、影響和解決方案。

Transmission lines equations for coupled lines symmetrical lines and symmetrically driven homogeneous medium symmetrical lines in homogeneous medium symmetrical lines and asymmetrical driven Qualitative description of crosstalk Terminations Measurement of crosstalk parameters How crosstalk noise can be reduced

本文档主要介绍了信号完整性与电源完整性的研究与仿真

本文档主要介绍如何使用电子元器件搭建理想的balun设计

本文档主要介绍在Cadence Virtuoso软件种将 SPICE网表导入指南

This is a new book to replace Low-Noise Electronic Design (0 1973). All the relevant topics from the original book are included and updated to today's technology. Since the emphasis has been expanded to address the total system design from sensor to simulation to design, the title has been changed to reflect the new scope. A significant improvement is the change of technological emphasis. The first book emphasized discrete component technology with extensions to ICs. The new book focuses on IC design concepts with added support for discrete design where necessary. Additionally, considerable theoretical expansion has been included for many of the practical concepts discussed. This makes the new book serve very well as a textbook. Six completely new chapters have been added to support the current direction of technology. These new chapters cover the use of SPICE and PSpice for low-noise analysis and design, noise in feedback amplifiers which are extensively used in IC designs, noise mechanisms in analog/digital and digital/analog converters, noise models for many popular sensors, power supplies and voltage references, and useful low-noise amplfier designs.

本文档主要使用ANSYS软件进行电磁仿真的优秀的应用论文

应用COMSOL和matlab进行联合仿真验证与参数反分析研究

Agilent Impedance Measurement Handbook A guide to measurement technology and techniques 4th Edition

应届生找工作+常见电子类硬件笔试题整理大全(含答案)+硬件工程师笔试试题集大全+模拟、数字电子技术

《微弱信号检测》主要包括低噪声技术，频域信号的相干检测等

本文档主要介绍了集成电路的版图设计，基础实用指南与教程

An 840-GHz Schottky diode detector is integrated with an analog lock-in amplifier in 130-nm bulk CMOS. The integrated lock-in amplifier can support a modulation frequency of up to 10MHz with a gain of 54dB, a dynamic range of 42dB, and an input referred noise of less than 10 nV/ √Hz at modulation frequencies higher than 100kHz. The integrated lock-in amplifier occupies an area of 0.17 mm2 and consumes 4.9mA from a 1.2-V supply. The detector and on-chip lock-in amplifier combination was used to form terahertz images.

文档主要是介绍了nios ii双核开发的例子。