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PCB制作流程 底片设计 制作规范 主要制作流程摘要

This book goes beyond the theory and describes in detail the design of filters from concept through fabricated units, including photographs and measured data. Contains extensive practical design information on passband characteristics, topologies and transformations, component effects and matching. An excellent text for the design and construction of microstrip filters.

Handbook Electronics, Power Electronics, Optoelectronics, Microwaves, Electromagnetics, and Radar

印刷電路板設計-在真實世界中的EMI控制 EMI EMC介绍

1. 目的和作用 1.1。 2. 适用范围 1.1 3. 责任 3.1 XXX开发部的所有电子工程师、 4. 资历和培训 4.1 有电子技术基础; 4.2 4.3 熟悉利用电脑PCB绘图软件. 5. 工艺要求(所有长度单位为MM) 5.1 铜箔最小线宽:单面板0.3MM,双面板0.2MM，边缘铜箔最小要0。5MM 5.2 铜箔最小间隙:单面板:0.35MM,双面板:0.25MM. 5.3 铜箔与板边最小距离为0.5MM,元件与板边最小距离为1MM,焊盘与板边最小距离为1MM。

C51开发全国网址及开发实例！

针对ACEX1K30TC144-3