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cadence元件封装设计流程讲解

如何运用cadence自己设计元件封装,本文件中有详细讲解,对于初学者帮助斐然

2011-08-17

IC元件封装大全封装总结

IC封装总结,含有主要的IC封装,尾部附有常用封装的图片

2011-08-17

贴片电容标称容值封装耐压值详解

有关贴片电容容值和封装关系和耐压值的详细列表,包含了NPO X7R Y5V等主要电容类别,

2011-08-17

纽扣电池型号分类详解

关于纽扣电池型号分类方法的解释,对于初学者有很大帮助

2011-08-17

代码反查,贴片元件反查手册

通过贴片元件上的简易marking反查相应具体元件,对于电路分析有很大帮助

2011-08-17

高频电子电路中的耦合电容详解

有关高频电子电路中的耦合电容的讲解,希望对初学者能有所帮助

2011-08-17

晶振负载电容计算(PCF8563举例)

关于晶振负载电容大小的计算,PCF8563例解

2011-08-17

并行处理与体系结构Computer Architecture

有关并行处理结构很不错的一本书 Chapter 1 Fundamentals of Computer Design 1.1 Introduction 2 1.2 Classes of Computers 4 1.3 Defining Computer Architecture 8 1.4 Trends in Technology 14 1.5 Trends in Power in Integrated Circuits 17 1.6 Trends in Cost 19 1.7 Dependability 25 1.8 Measuring, Reporting, and Summarizing Performance 28 1.9 Quantitative Principles of Computer Design 37 1.10 Putting It All Together: Performance and Price-Performance 44 1.11 Fallacies and Pitfalls 48 1.12 Concluding Remarks 52 1.13 Historical Perspectives and References 54 Case Studies with Exercises by Diana Franklin 55 Chapter 2 Instruction-Level Parallelism and Its Exploitation 2.1 Instruction-Level Parallelism: Concepts and Challenges 66 2.2 Basic Compiler Techniques for Exposing ILP 74 2.3 Reducing Branch Costs with Prediction 80 2.4 Overcoming Data Hazards with Dynamic Scheduling 89 2.5 Dynamic Scheduling: Examples and the Algorithm 97 2.6 Hardware-Based Speculation 104 2.7 Exploiting ILP Using Multiple Issue and Static Scheduling 114 。。。。。。。。 。。。。。。。。。

2010-09-16

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